The electrical resistivity of dilute metallic solid solutions

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Morphology and electrical resistivity of metallic nanostructures

The electrical resistivity r of Au, Al and Cu films prepared by thermal evaporation with thickness range from 3 to 100 nm on glass substrates were studied. The r value was measured and theoretically evaluated by the Fuchs–Sondheimer (F–S), the Mayadas–Shatzkes (M–S), and the combined models. Measured r values in Al films were about seven times minor than for Au and Cu films for the minimum (3 n...

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ژورنال

عنوان ژورنال: Transactions of the Faraday Society

سال: 1921

ISSN: 0014-7672

DOI: 10.1039/tf9211600570